Automatic High Speed Epoxy Die Bonder Machine Manufacturer

• Customization: Available
• After-sales Service: Free Training
• Condition: New
• Speed: Super High Speed
• Precision: High Precision
• Certification: RoHS, CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• Product Name: Die Bonder Machine
• Item Number: Shark-1
• Leading Production Capacity: 20000uph
• Welding Head Force: 30- 300 G
• Wafer Size: 12~8 Inches
• Transport Package: Wooden Box by Sea Shipping
• Specification: standard package
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Fully Automatic Die Bonding Machine System manufacturer

Product Description

This is a fully automatic silver paste die bonding machine. It combines ultra-high speed and high precision. It is suitable for general IC and discrete devices. It is suitable for wafers up to 12 inches. With an excellent dispensing control system, this fully automatic high-speed silver paste die bonding machine is your absolute first choice.

Leading production capacity:  20000UPH
Excellent accuracy: ±20μm@3σ
High-density lead frame processing
Precision-controlled dispensing system
Universal track design for a variety of packages
Compound feeding (optional)

Detailed Photos

Product Parameters

Specification

UPH: 20000
XY Placement Accuracy: ± 20 μm @ 3σ
Chip Rotation
Die size:>1x1mm, ± 0.2° @ 3σ
Die size:<1x1mm, ±1@3σ
Material Handling Capability
Chip Size
Standard: (0.25 x 0.25- 14 x 14 mm²)
Frame Size
Length: 100-300 mm
Width: 15-100 mm
Thickness: 0.1-0.8 mm
Cassette Size
Length: 110-310 mm
Width: 20-110 mm
Height: 70-153 mm
Welding head system
Welding head force: 30- 300 g (programmable)
Wafer system
Wafer size: 12~8 inches



 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.