| Customization: | Available |
|---|---|
| After-sales Service: | Free Training |
| Function: | High Temperature Resistance, Anti-Corrosion, Anti-Cold |
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1,Scope of application
The organic waste gas flow rate is less than 200 Nm3/h; the general exhaust gas concentration is more than 5000 mg/Nm3.
2,application area
The organic waste gas produced in the process of industrial kiln burning, such as the process of soft magnetic ferrite drainage, the process of Zinc Oxide valve cutting, the firing process of graphite negative electrode, the sintering process of electronic components and so on. Finally, the exhaust emission achieves no odor and smokeless purification effect, which is superior to the national emission standard.
3,Equipment features
1, according to the different needs of customers, exhaust air volume and exhaust gas concentration, we design an organic waste gas electric heating and purifying equipment meeting the working conditions in the field.
2, compact and flexible, easy to install, can be fixed beside the equipment, or directly installed on the exhaust pipe of the top of the equipment to reduce the area of occupation
3, energy saving effect is good, according to different ignition points of exhaust gas, adjust the control temperature of incinerator.
4. The control is simple, convenient and pollution-free. The furnace body is heated by resistance wire, and there is no two pollution of fuel.
4,Application field
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3: OEM/ODM/Designing.
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