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Product advantages
This is a high-speed thermal bonder designed for thermal bond encapsulation of low-power devices. The welding head, wafer platform, and positioning camera all use a linear drive system. The core components such as the extended pattern recognition function have been verified by a large amount of reliability data, which can bring industry-leading productivity and reliability to customers.
Product performance
MTBA improves - optimized image recognition capabilities
·Optimized and improved hardware equipment
·High-resolution digital camera
·Optimized optical system design, clearer images
Enhanced track design
·Supports lead frame 100mm
·Advanced constant temperature control system
Easy to operate
·No need to use Gauge to replace nozzles
Improve the speed of nozzle replacement
·Simple three-point alignment
·Even on-site operators can easily use this function with simple training
Control and monitoring of welding quality
·Pick tool wear monitoring function helps to monitor the process of the nozzle
·Post Bond function can intuitively evaluate the welding quality
·Can be turned on or off as needed
·Post-weld data collection and analysis helps quality control
·Welding pressure continuous switching Coring and fixing can use different pressures
·Welding process monitoring function (BPM) can effectively set the monitoring range
Equipment maintenance and reliability
·Reduce maintenance
·Use fewer moving parts Platform X, Y, rear camera Y motor direct drive
·Modular design makes equipment maintenance and maintenance more convenient
·Proven performance
Company Profile
Exhibition & Customers
Packaging & Shipping
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
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