| Customization: | Available |
|---|---|
| After-sales Service: | Free Training |
| Warranty: | 1 Year |
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| Processing object | silicon carbide wafers |
| Laser type | Infrared picosecond pulsed laser |
| Cooling method | air-cooled |
| X-axis | stroke 450mm, resolution 0.1μm |
| Y-axis | stroke 700mm, resolution 0.1μm |
| Z-axis | stroke 20mm,resolution 0.1μm |
| θ axis | travel 120°, resolution 0.001° |
| Processing size | 6 inches(upgradeable to 8 inches) |
Equipment Advantage
1. Provide a complete set of split & expansion equipment, complete solution.
2. The process is mature and can be cut for different types of silicon carbide wafers.
3. Fast cutting speed, good cutting effect and high yield.
Applications
1. Aerospace and Power Electronics Industries.
2. Specifically designed for cutting wafers with silicon carbide (SiC) substrates used in microwave devices and power devices.
Samples
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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