Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | High Temperature Resistance |
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Basic Info.
- Model NO.
- GM-01
- Demoulding
- Automatic
- Condition
- New
- Certification
- RoHS, ISO, CE
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Desktop
- Driven Type
- Electric
- Mould Life
- >1,000,000 Shots
- Product Name
- Wafer Back Grinding Equipment
- Feature 1
- High Precision
- Feature 2
- High Efficiency
- OEM/ODM Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 100
Product Description
Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
Equipped with material information scanning and input system
Equipped wtith wafer level handling robot
Equipped with Fool-proofing system to identify the positive and negative side of the wafer
Equipped with water ring vacuum pump to ensure the stable vacuum and the small vibration
Equipped With a visual management system for the grinding process
Equipped with customized ultra-precision chuck table base,excellent performance, small vibration, that can adapt to different hardness of wafer materials
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1. Applicable Products:Si wafer,glass,metal plating
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2. Processing method:full-automatic
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3. Applicable wafer size: 100mm-200mm
-
4. Final product thickness:80μm
-
5. Grinding speed:0.1μm-50mm/s
-
6. Z-axis minimum stroke:120mm
-
7. Applicable material thickness:≤1800μm
-
8. TTV:≤2.5μm,WTW≤2.5μm,Ra≤0.02μm
| Category | Parameter | Specification |
| Applicable Products | Substrate Materials | Si wafer, Glass, Metal plating |
| Process & Control | Processing Method | Full-Automatic |
| Applicable Wafer Size | 100 mm - 200 mm | |
| Final Product Thickness | 80 μm | |
| Grinding Speed Range | 0.1 μm/s - 50 mm/s | |
| Mechanical Performance | Z-axis Minimum Stroke | 120 mm |
| Applicable Material Thickness | ≤ 1800 μm | |
| Precision & Quality | Total Thickness Variation (TTV) | ≤ 2.5 μm |
| Within Wafer Thickness (WTW) | ≤ 2.5 μm | |
| Surface Roughness (Ra) | ≤ 0.02 μm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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