High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device

• Customization: Available
• After-sales Service: 7*24 Hours
• Function: High Temperature Resistance
• Model NO.: Himalaya-26
• Demoulding: Automatic
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• X-Y Table: 105×105mm Stroke
• Z-Axis: 120° Rotation
• Splitting Yield: ≥99.5%
• Equipment Uptime: ≥95%
• Mean Repair Time: ≤12 Hours
• Machine Dimensions: 1650×1200×1700mm (W×D×H)
• Power Supply: 220V, 50Hz, 10A
• Alignment: CCD Auto-Alignment
• Transport Package: Crate
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 22222

Product Description

Product Description

This machine is equipped with a wafer splitting device for brittle materials such as 2 "~8" LED/SIC/glass/ceramic. The laser processed wafer is supported by the receiving platform as a reference, supplemented by the splitting action of the blade lifting to separate the chips. During the splitting process, the CCD automatically corrects and takes photos to detect the splitting effect, ensuring that the equipment can quickly and accurately split; And achieve unmanned production, manual only needs to perform intermittent loading and unloading of material frames.

Key Features & Specifications

1. Loading/Unloading Mechanism

• Material Handling:
  • 25-layer standard cassette with ±5mm wafer patch positioning.
  • Iron ring specs: 6-inch size, <0.3mm dimensional tolerance, <1mm max deformation.
• Automation:
  • Chip gripper with material retrieval anomaly detection.
  • 30° max wafer mounting angle tolerance.

2. Precision Alignment & Splitting

• CCD Auto-Alignment:
  • Edge detection for fragments (<2mm radius).
  • θ-angle servo correction + splitting position accuracy: 0.005mm.
• Blade Mechanism:
  • Servo-controlled lift (1µm accuracy).
  • Hardened blade (HRC65) with parallelism adjustment.

3. Production Metrics

Wafer Size	Chip Specs (µm)	Cycle Time	Hourly Output	Monthly Capacity*
4-inch	533×254	250s	14.4 chips	9,187
4-inch	102×125	695s	5.2 chips	3,203
*22 hrs/day, 28 days/month

4. Motion Control & Mechanics

• X-Y Table: 105×105mm stroke, ±2µm repeatability, 110mm/sec speed.
• Z-Axis: 120° rotation, ±10 arc-sec precision.
• F-Axis (Splitting): 60mm stroke, ±1µm accuracy, 50mm/sec speed.

5. Quality Assurance

• Splitting yield: ≥99.5%
• Equipment uptime: ≥95%
• Mean repair time: ≤12 hours

Process Flow

1. Wafer Loading: Wide-angle CCD captures contour for positioning.
2. Laser Path Alignment: Visual calibration to µm-level accuracy.
3. Splitting: Blade (6µm width) applies controlled force along laser scribe.
4. Output: Fragments separated with minimal edge collapse (<5µm support table flatness).

Key Innovation: Non-adhesive protective film (25µm) reduces blade contact damage.

 

Technical Parameters

Component	Specification
Machine Dimensions	1650×1200×1700mm (W×D×H)
Power Supply	220V, 50Hz, 10A
Operating Environment	20-25°C, 20-60% humidity
Compressed Air	0.6MPa, Φ8mm interface

 

Applications & Markets

• Materials: 2"-8" LED/SiC/glass/ceramic wafers.
• Chip Size: 24×24 to 60×60 mils (custom visual hardware available).
• Customers: Serves 200+ clients across 30+ countries (e.g., Himalaya Semiconductor).

Partial sample effect
5.3 Machine Placement Requirements (W) 1650 ×  (D) 1200 ×  (H) 1700 (mm) (excluding signal lights)Additionally, at least 600mm should be reserved around the perimeter
Environmental requirements for use
Power demand 220V/single-phase/50Hz/10A
Environmental temperature 20-25 ºC
Environmental humidity 20% -60%
Compressed air 0.6MPa
Compressed air interface Φ 8mm
Environmental vibration requires foundation amplitude<5 μ M
Vibration acceleration<0.05G

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd.

Company Overview

• Established: 2019
• Core Focus:
  • International trade & supply chain integration of semiconductor equipment
  • Procurement optimization with cost-performance ratio control
  • Risk-mitigated transactions (one-time payment collection for suppliers)
• Global Reach:
  • Exporting to 30+ countries
  • Serving 200+ customers & suppliers

Mission: Bridge high-efficiency semiconductor equipment with global demand through integrated trade solutions.

 

Product Portfolio

1. Die Attachment & Interconnect

• Die Bonder:
  • High-precision placement (accuracy ≤1µm) for CSP/QFN/BGA packages
  • Throughput: 15K UPH (examples: MEMS, power devices)
• Wire Bonding:
  • Gold/Aluminum/Copper wire (25-500µm diameter)
  • Capable of 20µm pad pitch

2. Laser Processing Systems

Product	Key Applications	Technical Highlights
Laser Marking (ID/IC Wafer)	Wafer traceability, alphanumeric/2D codes	10µm resolution, 300mm/s marking speed
Laser Grooving	PCB depaneling, SiC wafer scribing	20-100µm groove width, ±2µm repeatability
Laser Cutting	Glass/ceramic wafers (≤1mm thickness)	Crack-free edges, 150W pulsed laser
Laser Internal Modification	Si/SiC wafer stealth dicing, LT/LN wafer processing	1064nm/355nm wavelength options
Laser Annealing (Si/SiC)	Dopant activation, defect repair	Uniformity ≤3% across 300mm wafers

3. Mechanical Processing

• Automatic Dicing Saw:
  • Blade dicing (≤50µm kerf) for wafer packaging
  • Compatible with 2"-12" wafers (Si, GaAs, glass)
• Supporting Equipment:
  • Silicone Dispensing Systems:
    • Jet/needle dispensing (0.1mm dot accuracy)
    • UV/thermal cure options

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.