Product Features
• Completely independent intellectual property rights
• Compatible with multiple loading methods
• Standardized application software
• Safe and efficient transmission
• SECS/GEM communication
• Deep customization
• Capable of handling thin wafers
Technical Specifications
• Wafer size: 4''-12'' single size or two similar sizes compatible and customizable
• Number of loading ports: Standard Load Port *1 or other loading forms can be customized
• Wafer transfer:
Dual-arm wafer transfer robot • Wafer picking method:
Vacuum, Bernoulli, clamping or other structures can be customized
• Wafer alignment: Standard wafer edge patroller
• Wafer ID reading: Single-sided/double-sided wafer ID dedicated reader
• Communication: Support standard SECS/GEM or simple networking
• Cleanliness: Multiple levels can be customized, up to Class1
• Power supply specifications: Single-phase AC220V±10% 50HZ 10A
• Air source specifications: Positive pressure 0.5-0.7MPa clean dry compressed air, negative pressure better than -60kPa
• Output: ≥150 (including OCR)
• Equipment size: 1465×1397×2215mm
• Weight: ≈550kg