Customization: | Available |
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After-sales Service: | Provide |
Warranty: | 12 Months |
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The wafer roughing mill is a polishing machine equipped with diamond blades. It can use transparent technology to analyze and grind several samples to a thickness of less than 100 µ at the same time. This product is mainly used by geologists who are committed to studying a large number of ore samples.
This product is fully automatic, fast and accurate, and can grind more than 20 samples in a few minutes.
This machine replaces all traditional manual operation technologies: saw blade, grinding, rough grinding. It can easily, automatically and effectively solve the problems encountered in manual sample preparation in many laboratories.
Performance:
Size: width: 850mm; Thickness: 700mm; High:
1100mm ; Weight: 190kg
Sample size: 20 30x45mm samples are processed at the same time
Sample holder: 30x45mm and 45x60mm
Accuracy: 1/100mm
Diamond blade: 200mm in diameter, 6mm in width.
Sample holder: 6~20 samples are placed in a grid, with two measurement units of mm or size. (10 standard units)
Power supply device: network cable: 220/380V, three-phase, 50HZ
Motor: 2HP; Baffle: 1/6 HP; Cycle: 1/3RD HP
Circulation unit: 461 capacity
After the sample is glued on the standard plate table, the machine can grind the thin rock accurately to within 100 μ m in just a few minutes
The operator only needs to put the sample into the sample holder and then turn on the machine. There is no need for personnel to watch the whole grinding process. When the sound of machine operation is not heard, the whole grinding process is over.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.