Semiconductor Equipment Automatic Substrate Laminating Machine

Product Details
Customization: Available
After-sales Service: 1 Year
Warranty: 1 Year
Diamond Member Since 2023

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  • Semiconductor Equipment Automatic Substrate Laminating Machine
  • Semiconductor Equipment Automatic Substrate Laminating Machine
  • Semiconductor Equipment Automatic Substrate Laminating Machine
  • Semiconductor Equipment Automatic Substrate Laminating Machine
  • Semiconductor Equipment Automatic Substrate Laminating Machine
  • Semiconductor Equipment Automatic Substrate Laminating Machine
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  • Overview
  • Product Description
  • Company
  • Our Partner
  • Packaging & Shipping
  • After Sales Service
Overview

Basic Info.

Model NO.
HMLA-ABM01
Machine Size
2600X1200X2000mm
Machine Weight
1500kg
Jig Size
8&12
Support Base Analysis Size
190X70 to 270X85(mm)
Transport Package
Wooden Case
Specification
0*0*0
Trademark
none
Origin
China

Product Description

Product Description
 
Semiconductor Equipment Automatic Substrate Laminating Machine



Automatic substrate laminating machine is our independent research and development, manufacturing of high performance, high stability, high yield automatic substrate laminating machine. Manually place the material box or Magazine containing the substrate and the membrane ring into the device.  Equipment operation will automatically take out the substrate in the material box or Magazine, put it into the working area, the membrane ring is also put into the working area;  Then automatic film, film cutting operations.  After finishing the film, put the finished product into the receiving box. Save manpower, avoid human-caused errors and increase output.



Characteristics

01 Compatible with multi-size substrate \film ring applications

02 Magazine/Material box/basket canbe loaded without stopping

03 Product switching is quick and easy

04 Menu function options fordifferent applications

05 High stability,no bubbles

06 High speed production mode withhigh precision

Key features

1. Machine size:2600x1200x2000mm
2. machine weight:1500KG
3. Jig size:8&12
4. Support base analysis size:190x70 to 270x85(mm)
5. label size:<=100x100mm
6. Product switching time:<=10min
7. Storage quantity:Magazine*4 \ Material box *8\ basket *4
8. Uph:<=180pcs rings
9. Labeling function:OK
10. Number of membrane rings stored:<=150pcs
11. failure rate:<1/3000
12. data acquisition:Jam rate,UPH,Yield

 
Company

 

Semiconductor Equipment Automatic Substrate Laminating Machine
Our Partner

 

Semiconductor Equipment Automatic Substrate Laminating Machine
Packaging & Shipping

Semiconductor Equipment Automatic Substrate Laminating Machine

After Sales Service

 

Semiconductor Equipment Automatic Substrate Laminating Machine

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