High Precision Die Bonding Die Attach Machine for PCB/IC Packaging or Assembling

• Customization: Available
• After-sales Service: Provided
• Function: High Temperature Resistance
• Model NO.: HMLY-D-01
• Demoulding: Automatic
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: 300,000-1,000,000 Shots
• Product Name: Semiconductor Equipment
• Feature: High Precision, High Efficiency
• Vacuum System: 0.1~100 Kpa, Flow Rate ≥50 L/Min
• After-Sale Service: Provided
• Die Size: 0.17×0.17 mm ~ 6.25×6.25 mm
• Wafer Size: 6-10 Inch
• Placement Force: 30~500 G (Programmable)
• Vision Resolution: 640×480 Pixels
• Motion Control: Servo Motors, Linear Guides
• Work Load: ≤15 Kg
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya Semiconductor
• Origin: China
• Production Capacity: 100PC

Product Description

 

Product Description

The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, high-precision linear-driven bond head, and a highly accurate die rotation system. With support for 6" to 8" wafers and customizable options, it ensures precise die placement and versatile compatibility for various applications.

High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine

 

• DA1201 IC Linear High Precision Die Attach

  Wafer size: 6"- 12";

  Dual dispensing system;

  High-precision linear driven bond head;

  Support DAF function;

  Multifunction work table, suitable for different kinds of lead frames & substrates;

  High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;

  Intelligent dispensing control system to realize precision glue volume control;

  Missing die detection and re-picking function;

  Programmable Pick / Bond Force;

  Customization for special design is also available.

Key Features

DA801 IC Linear High-speed Die Attach
Wafer size: 6"- 8"

Dual dispensing system

High-precision linear driven bond head

Support DAF function

Multifunction work table, suitable for different kinds of lead frames & substrates

High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system

Intelligent dispensing control system to realize precision glue volume control

Missing die detection and re-picking function

Customization for special design is also available.

Product Parameters

Automatic Die Bonder Parameter Comparison Table, structured in a clear tabular format with technical explanations:

1. Equipment Model & Basic Parameters

 

Parameter	DA801	DA801S/DA801M	Technical Notes
Cycle Time	220 ms	-	Speed comparable to mid-to-high-end international machines (e.g., ASM Semiconductor ~250 ms).
Substrate Size	110×320 mm ~ 300×320 mm	110×300 mm ~ 300×300 mm	Supports large-size LED/power device packaging; compatible with glass, ceramic, PCB, etc.
Die Size	0.17×0.17 mm ~ 6.25×6.25 mm	-	Covers Mini/Micro LED (≤1 mm²), traditional LED (≤50 mil²), and power semiconductor dies.
Wafer Size	6-inch ~ 8-inch	-	Compatible with mainstream semiconductor wafers (150 mm, 200 mm post-sawing).

1. Core Performance Metrics

 

Parameter	DA801	DA801S/DA801M	Industry Benchmark
XY-Axis Precision	±25 μm @ 3σ	±10~20 μm @ 3σ	High-precision models (DA801S/M) match advanced international standards (e.g., automotive-grade ≤50 μm).
θ-Axis Precision	±1°	-	Rotation error control for QFN packaging (≤0.5°) and 3D stacking.
Placement Force	30~500 g (programmable)	-	Adapts to GaAs/SiC chips and bonding materials (gold wire, copper wire, epoxy).
Vision Resolution	640×480 pixels	-	Multi-color PR system; real-time alignment ≤0.5 sec/die.

3. Key Components
 

Component	Specifications	Technical Highlights
Optical Recognition	Multi-color PR (R/G/B) + Auto-Focus	Supports mixed-color chips (e.g., red/green/blue LEDs, ICs).
Motion Control	Servo motors, linear guides	Repeatability ±1 μm (vs. old models' ±3 μm).
Worktable Load	≤15 kg	Compatible with thick-copper substrates (3~5 mm) and large heat sinks.
Vacuum System	0.1~100 kPa, flow rate ≥50 L/min	Fast suction/release for thin dies (≤0.15 mm).

 

1. Dimensions & Scalability

 

Parameter	Value	Application Scenarios
Equipment Size	2100×1260×1500 mm (W×D×H)	Standard standalone design; integrates into semiconductor lines; robotic arm-ready.
Weight	1100 kg	Requires stable foundation for cleanroom (Class 10000).
Interface	Ethernet/IP protocol	Connects to MES for production data tracking/remote maintenance.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.

Our mission is to deliver the highest value at the final procurement stage, ensuring:
1. Cost Efficiency - Competitive pricing without compromising quality
2. Risk-Free Transactions - Secure one-time payment solutions for suppliers
3. Reliable Integration - End-to-end equipment and technical support
 

 

Packaging & Shipping

 

FAQ

1. What is the placement accuracy of your die bonding machines?

• Standard accuracy: ±1.5µm (for most IC packaging)
• Ultra-high precision (flip-chip/3D IC): Sub-micron (±0.5µm) with vision alignment

2. Which bonding materials are compatible?

• Adhesives: Epoxy, polyimide, silver paste (dispensed or pre-applied)
• Thermal interfaces: Solder balls (SnAg, SAC alloys), DAF (Die-Attach Film)
• Emerging tech: Nano-sintering for high-power devices.

3. Can the machine handle multi-die stacking or heterogeneous integration?

• Yes. Features include:
  • Multi-head bonding (pick-and-place + flip-chip)
  • Laser-assisted alignment for vertical stacking
  • Active heating stages (up to 400°C for solder bonding).

4. How is throughput optimized for mass production?

• Speed: Up to 20,000 UPH (units per hour) with linear motors
• Automation: Integrated wafer frames/tape feeders + robotic loaders
• Parallel processing: Dual-lane conveyors for PCB panels.

5. What's the smallest die size supported?

• Minimum die size: 0.2mm x 0.2mm (with vacuum collet tools)
• Thickness range: 50µm-1mm (including ultra-thin wafers).

6. How do you ensure bond strength reliability?

• In-situ inspection: 2D/3D AOI (Automated Optical Inspection)
• Force sensors: Real-time bonding pressure feedback (0.1g resolution)
• Post-bond testing: Shear/pull force metrology optional.

7. Is the system compatible with cleanroom environments?

• Class 100/ISO 5 compliant (vibration-damped, HEPA-filtered)
• ESD-safe: Full grounding for GaAs/SiC semiconductor handling.

8. What software interfaces are available?

• SECS/GEM for semiconductor fabs
• Custom recipes: Save parameters per material/device type
• Predictive maintenance: AI-driven nozzle wear monitoring.

9. What's the typical machine footprint?

• Compact models: 1.2m x 1.5m (bench-top for R&D)
• Production line: 2m x 3m (with auto-loading modules).

10. Do you offer process development support?

• Free DOE (Design of Experiments) for new materials
• On-site training for parameter optimization (e.g., temperature, force, time profiles).