Wafer Inspection System, Clear Images + High Contrast +Minimal Flare, Yield and Stability Improvement

• Customization: Available
• After-sales Service: on-Site Available
• Warranty: 1 Year
• Model NO.: 3200/3100/3000
• Type: 3D Video Measuring System
• Operate Method: CNC
• Transport Package: Wooden Box
• Origin: Japan
• HS Code: 9031499000
• Production Capacity: 1000

Product Description

Key features

(1) Produce clear images with high contrast and minimal flare. Acclaimed wide illuminator and line illuminator enable macro inspections under ideal  conditions.
(2) State-of-the-art images processing and analysis technology enables highly accurate review inspections.
Flexibiliy in load port positioning allows this equipment to meet a variety of layouts and requirements of factory automation handling 300mm wafers. OHT and other automatic transfer system s are supported too.
(3) Optiamal recipe conditions are simply created by an easily accessible touch-screen. According to specifications of objective lens and wafer that is inspected, optimal observation settings, including aperture and light intensity can be set in advance.

(4) Inherits a system that boasts the high system stability and high-transfer rate, proven in front end process.

(5) In addition to macro surface inspection, the system comes standard with edge inspection and the center of wafer back sides. The control of rotation speed and tilt angle during macro inspection can be mannually adjusted from the default positon using a joystick.

(6) With extra-long working distance lens and this puppresses image skipping when switching objectives from low to high magnification, enabling the system to deliver superior operatability and stability, combined with high resolution.

(7) Loading a 200mm cassette adapter enables the cobined transfer of 200-300 mm wafers on a single unit. There is no need for bothersome adjustments when making inch-size changes thanks to the load port's auto recognition of cassettes and the design of two-size shared parts. System uptime is thereby dramatically improved.

Specification

3200	2 load port/300 mm wafer (200 mm wafer: option)
3100	1 load port/300 mm wafer (200 mm wafer: option)
3000	1 load port/300 mm wafer or 200 mm wafer

Packing & Delivery

Wooden box with foamed polyester materials to protect the contents safely.

Professional carriers by land/sea/flight routines to deliver all over the globe.

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.