High Precision High Power Ultraviolet Picosecond Laser Cutting Machine

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-5060
• Application: Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising Industry
• Cooling System: Water Cooling
• Technical Class: Pulse Laser
• Applicable Material: Metal
• Structure Type: Dual-Platform
• Laser Classification: Semiconductor Laser
• Laser Technology: Laser Control Fault Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

 

Product Description

Ultraviolet picosecond laser cutting machine
It adopts a precision marble platform, which is stable in load-bearing and corrosion-resistant.
High-precision galvanometer scanning head, with low temperature drift and stable accuracy after long-term use;
High negative pressure air conditioners are adopted to adsorb the products to ensure the stability of positioning. Built-in power voltage stabilizer, safety protection equipment electrical appliances, stable and reliable;
It is equipped with an automatic alignment CCD and a visual lens, which can accurately identify mark points.
High-power picosecond lasers feature fast processing speed, high stability and long service life.
The processing platform is fully closed-loop driven by imported linear motors combined with optical scales, which is easy to maintain, has a long service life and high precision.

 

Main Parameter

Equipment Name	Dual-Platform UV Picosecond Laser Cutter	Single-Platform UV Picosecond Laser Cutter
Model	HMLA-5060D	HMLA-5060
Laser Source
Laser Type	UV Picosecond Pulsed Laser
Laser Power	10W, 15W, 20W, 30W (Optional)
Wavelength	355nm
Pulse Width	<10ps
Pulse Frequency	≤2MHz
Cooling Method	Water Cooling
Cutting Performance
Cutting Method	Electric Z-Axis + 2D Galvo
Cutting Head	Telecentric Lens
Lens Range	Ø50mm, Ø100mm (Optional)
Cutting Speed	0-6000mm/s
Cutting Thickness	≤1.5mm (Recommended)
Edge Chipping	≤10µm
Platform Size	500×600mm (Dual Platform)	500×600mm (Single Platform)
Drive Motor	XY Linear Motor, Z-Axis Servo Motor
Positioning Accuracy	≤±2µm
Repeatability	≤±1.5µm
Software Support	Compatible Formats: DXF, DWG
Dust Extraction	High-Vacuum Fume Extractor, AC380V, 4.4KW
Power Supply	AC220V±5%, L+N+E, ≤3.5KW
Dimensions	1760mm (L) × 1750mm (W) × 1750mm (H)
Weight	<2000kg
Floor Load	>500kg/m²

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

 

Field Application

 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.