| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 24 Months |
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Overview:
This product is a new type of equipment further improved and perfected by our company based on the integration of domestic and foreign advanced technologies. It is a high-tech product integrating machinery, electricity, gas and optics. This product is suitable for boxing and packaging of medicines, cosmetics, auto parts, electronics and daily necessities as well as similar items. It has automatic functions such as folding instructions, automatically opening cartons, item boxing, batch number printing, carton sealing, etc. (hot melt adhesive is also applicable). This machine can be used alone or in conjunction with other equipment to form a complete production line.
Features:
1.PLC automatic control system, variable frequency speed regulation, electrical components all adopt internationally well-known brands.Adopt human-machine operation system.
2.Adopt human-machine interface operation system.
3.Mechanical overload automatic shutdown.
4.Automatic rejection of cartons missing packaged items and instructions.
5.Fault display, alarm and finished product counting.
6.Stable performance, simple and easy to understand operation.
Main technical parameters
| Boxing Speed 30-100 boxes/min | ||
| Box | Quality requirement | 250-350g/m"(Depends on carton size) |
| Dimension range (LxWxH) | ( 70-210) mm X (20-90) mm X (15-90)mm (Custom sizes available) |
|
| Compressed air | Working pressure | ≥ 0.6mpa |
| Air consumption | 20m3/h | |
| Power supply | 380V 50HZ | |
| Main Motor Power | 1.5kw | |
| Machine Dimensions (LxWxH) | 3300X1350X1600mm | |
| Net Weight of Whole Machine | 1200kg | |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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