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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Business Type:
Trading Company
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Number of Employees:
11
Year of Establishment:
2019-09-12
Management System Certification:
ISO 9001
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
OEM/ODM Service
Overseas Agent / Branch
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Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory, Industrial Dispensing Machine Desktop Robot Glue Coating Dispenser Device Producer, Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Robot Equipment Factory and so on.

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Mr. Jack
Deputy General Manager
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All Products

Total 992 Products
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High Speed Fully Automatic Gold/Copper Wire Bonder
High Speed Fully Automatic Gold/Copper Wire Bonder
FOB Price: US $60,000-170,000 / Box
Min. Order: 1 Box
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Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
FOB Price: US $550,000-1,000,000 / Piece
Min. Order: 1 Piece
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Semiconductor Fully Automatic IC Marking Machine
Semiconductor Fully Automatic IC Marking Machine
FOB Price: US $100,000-3,000,000 / Piece
Min. Order: 1 Piece
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Fully Automatic ID Laser Marking Machine
Fully Automatic ID Laser Marking Machine
FOB Price: US $28,000-160,000 / Piece
Min. Order: 1 Piece
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Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
FOB Price: US $130,000-500,000 / Piece
Min. Order: 1 Piece
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Frame Laser Marking Machine with Integrated Post Label Detection System
Frame Laser Marking Machine with Integrated Post Label Detection System
FOB Price: US $100,000-200,000 / Piece
Min. Order: 1 Piece
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Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FOB Price: US $620,000-1,000,000 / Piece
Min. Order: 1 Piece
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High End Manufacturing Laser Sealing Machine
High End Manufacturing Laser Sealing Machine
FOB Price: US $68,493-136,986 / Piece
Min. Order: 1 Piece
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High End Laser Processing Ceramic Equipment
High End Laser Processing Ceramic Equipment
FOB Price: US $200,000-2,000,000 / Piece
Min. Order: 1 Piece
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High End Ceramic Punching Equipment with High Precision Laser Processing System
High End Ceramic Punching Equipment with High Precision Laser Processing System
FOB Price: US $200,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
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Semiconductor Wafer Laser Stealth Cutting Equipment
Semiconductor Wafer Laser Stealth Cutting Equipment
FOB Price: US $700,000-1,000,000 / Set
Min. Order: 1 Set
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4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
FOB Price: US $1,400,000-2,000,000 / Piece
Min. Order: 1 Piece
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Automated Handling System Mobile Robots Logistics Operations Machine Manufacturer
Automated Handling System Mobile Robots Logistics Operations Machine Manufacturer
Min. Order: 1 Set
Contact Now
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High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
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Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
FOB Price: US $1,000,000-3,000,000 / Set
Min. Order: 1 Set
Contact Now
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High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
FOB Price: US $100,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
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High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
FOB Price: US $1,000,000-2,000,000 / Set
Min. Order: 1 Set
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High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
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8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
FOB Price: US $2,000,000-4,000,000 / Set
Min. Order: 1 Set
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High End Semiconductor Wafer Saw Machine
High End Semiconductor Wafer Saw Machine
FOB Price: US $200,000-500,000 / Set
Min. Order: 1 Set
Contact Now
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High End Semiconductor Fully Automatic Laser Ring Cutting Machine
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
FOB Price: US $90,000-2,000,000 / Set
Min. Order: 1 Set
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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now

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