Jiangsu, China
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Sample Available
Overseas Agent / Branch

Die Bonder, Wire Bonding manufacturer / supplier in China, offering Visual Glue Dispenser Machine Automatic CCD Three-Axis Desktop Dispensing Robot Equipment, High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment, High Quality Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width and so on.

Gold Member
Audited Supplier Audited Supplier

Others Semiconductor Equipment

Total 356 Others Semiconductor Equipment Products