Jiangsu, China
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Sample Available
Overseas Agent / Branch

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision SMT Red Glue Dispensing Machine for Electronics, Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning, High-Precision Laser IC Marking Machine with Clearance Feature and so on.

Gold Member
Audited Supplier Audited Supplier

Others Semiconductor Equipment

Total 357 Others Semiconductor Equipment Products